FEATURES:
Thermal compound for getting the maximum heat transfer from chip to heat sink.
Silver Cool is a specially formulated compound of Silver Oxide, Metal Oxide, Silicone, and Carbon to maximized heat transfer from your CPU to its heat sink.
Enough for 3-5 CPU's in a handy dispenser.

SPECS:
Silver Cool 1.5g
Viscosity: 76 CPS
Thermal Conductivity: >4.5W/mK
Thermal Impedance: <0.205 C-in?/W
Dielectric Constant A >5.1
Operation Temperature: -30 C to 240 C
Silicone Compounds: 50%
Carbon Compounds: 20%
Metal Oxide Compounds: 20%
Silver Oxide Compounds: 10%